Three LED display packaging technologies is MIP, COB or SMD screen?


Which of the top ten LED display packaging technologies is better, MIP, COB, or SMD? At present, LED display packaging technology is divide into three stages: traditional LED packaging, Mini-LED packaging, and Micro-LED packaging.

Mini-LED packaging currently has three technical routes, namely SMD, IMD, and COB

SMD screen can cover the application market above P0.9, but it is prone to bumps in small-screen applications and its reliability is slightly worse. COB eliminates the SMT patching process, can cover P0.4~P2, and emits light from a surface light source. Its light is soft, but it is prone to modular chromatic aberration. IMD combines the characteristics of SMD and COB. It can cover P0.4~P0.9 in point spacing, has strong anti-collision ability and strong reliability.

Micro-LED packaging has the following packaging technology routes

The first is a monolithic integrate package. This package has the characteristics of ultra-high resolution and ultra-high brightness, but it cannot solve the problem of colorization.

The second way is the optical synthesis of Microarray lenses, which has a relatively complex structure and cannot meet the requirements of high resolution and high brightness.

The third is a full-color solution of UV/B Micro-LED array plus RGB quantum dot color conversion. It can be seen that in addition to the poor stability of quantum dot materials, whether it is spraying, photolithography or color film, it has some difficulties that need to be overcome.

The fourth is the MIP full-color packaging based on RGB Micro-LED, which can take into account both yield and cost, and is the most feasible for mass production. The core is to reduce the use threshold and cost of Micro-LED, and is the most feasible for mass production. , the core is to solve the problem of lowering the threshold for using Micro-LED and realizing full testing and sorting.

MIP (Micro LED in Package) is essentially an organic combination of Micro LED and discrete devices, which means that the entire large-area display panel is package separately so that its yield control will be greatly improved in a smaller area. At the same time, the testing process starts from the chip and moves later to the packaging segment will effectively reduce the cost increase rate.

MIP combines Micro-LED chips with high-precision carrier boards to achieve fan-out packaging, which can reduce the difficulty of testing and downstream mounting. MIP devices can fully measure, sort, and mix RGB Micro pixels, making the display of the panel highly consistent. The MIP solution can screen out defects while performing color separation, ensuring the yield before shipment and reducing downstream repair costs. This also has certain advantages over traditional solutions. At the same time, MIP has better adaptability, and a MIP device can meet product applications with different point spacing.

MIP packaging technology can use current machines and equipment for production without significantly increasing equipment, which greatly reduces the company’s high investment in production line equipment. At the same time, MIP technology moves the testing that was originally require on the chip side to after packaging, and changes from chip testing to spot testing of pins. This greatly improves efficiency and further reduces costs, ensuring that downstream customers can use existing equipment. Micro LED displays can be produce.

From the perspective of product performance, MIP display modules also have the advantages of a high black ratio, special optical design, strong compatibility, and strong applicability. MIP packaging is also easier to detect and repair later.

COB is chip-on-board, which is chip-on-board packaging. It is a new packaging method that is different from outdoor SMD screen surface-mount packaging technology. Specifically, the bare chip is adhered to the PCB with conductive or non-conductive glue and then wire bond. The electrical connections are made together, and the chip and bonding wires are encapsulate with glue. This packaging method does not require packaging, but it integrates upstream and downstream enterprises. From packaging to the production of LED display unit modules or display screens, it is complete in one factory, integrating and simplifying the production processes of packaging companies and display screen manufacturing companies. , the production process is easier to organize and control, the point spacing of the product can be smaller, the reliability is double, and the cost is closer to civilians.

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